Solder paste extruded through stainless steel stencil onto gold-plated PCB pads, side lighting revealing paste texture

PCB Assembly Services

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Abstract geometric representation of an SMT production line with simplified machine shapes and copper trace-like connecting lines in isometric view
Surface Mount

SMT Assembly

High-speed surface-mount technology for dense, miniaturized PCB designs. Our automated SMT lines handle everything from 01005 chip components to fine-pitch BGA packages with closed-loop positional feedback on every placement cycle. Ideal for high-density digital boards, IoT devices, and consumer electronics where component density and repeatability are critical.

Minimum component: 01005 (0.4 mm x 0.2 mm) chip resistors and capacitors
BGA pitch: Down to 0.3 mm with X-ray verification on every joint
Placement rate: Up to 75,000 CPH across 6 high-speed lines
Max PCB: 510 mm x 460 mm, up to 32 layers, 3D AOI on every board
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Abstract DIP through-hole assembly with vertical component leads entering board holes and stylized wave shape below in isometric line-art
Through-Hole

DIP Assembly

Precision through-hole assembly for connectors, transformers, electrolytic capacitors, relays, and high-power components that demand mechanical strength and thermal resilience. Our wave and selective soldering lines run lead-free by default, with conformal coating available for harsh-environment applications.

Wave soldering: Lead-free process capable of handling boards up to 600 mm x 500 mm
Selective soldering: Precision nozzle soldering for mixed-technology boards with SMT components on the bottom side
Conformal coating: In-house acrylic, silicone, and polyurethane coating for moisture, dust, and chemical protection
Inspection: AOI plus manual visual inspection per IPC-A-610 Class 3 criteria on every joint
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Abstract mixed assembly showing SMT and through-hole components coexisting on a single board with two process flows merging in isometric line-art
Hybrid Technology

Mixed Assembly

Many real-world PCB designs require both SMT and through-hole components on the same board. Our mixed assembly service manages the full process sequence — SMT printing, placement, and reflow first, followed by through-hole insertion and selective soldering — so you do not need to split your order across multiple vendors. One board, one process, one accountable partner.

Process sequencing: SMT-first workflow with selective soldering for through-hole components, avoiding thermal damage to surface-mount parts
Component coverage: Full range from 01005 SMT passives to heavy-leaded through-hole connectors and transformers
Testing: Full functional test capability including boundary scan, in-circuit test, and custom test fixture development
Box build: Complete electromechanical assembly, enclosure integration, cable harness, labeling, and final packaging
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Compare

Service Capability Comparison

See which assembly service fits your project. Copper highlights indicate the best value in each row.

Capability SMT DIP Mixed
Max PCB Size 510 × 460 mm 600 × 500 mm 450 × 400 mm
Min Component 01005 (0.4 × 0.2 mm) 2.54 mm pitch Both (01005 SMT + 2.54 mm DIP)
Max Layers 32 16 24
Lead Time (Prototype) 3 – 5 days 5 – 7 days 5 – 8 days
Technology Coverage SMT only Through-hole only SMT + Through-Hole + Box Build
Why Choose Uppcba

Engineering Capabilities

Four numbers that define what our production lines can deliver on every project.

01005
Smallest Component Supported
0.3mm
Minimum BGA Pitch
24h
Prototype Turnaround Available
20+
Years Combined Engineering Experience

Not Sure Which Service You Need?

Our engineers can help you choose the right assembly process. Share your design files and we will recommend the optimal approach.

Talk to an Engineer