High-Speed Pick & Place
45,000
CPH
160
Feeders
SMT Assembly
High-speed surface-mount technology from 01005 passives to fine-pitch BGAs. Automated precision at every placement, verified by 3D SPI and dual-stage AOI.
ISO 9001
IPC-A-610
RoHS
UL
J-STD-001
SMT Process
Six-Stage Precision Assembly Line
Every board passes through six sequential stages with inline inspection at each critical node. No shortcuts, no skipped verifications.
1
Solder Paste Printing
Laser-cut stainless steel stencils precisely matched to your pad geometry. Fully automatic printer with fiducial alignment ensures deposit accuracy of ±25 μm at six-sigma repeatability. Stencil cleaning frequency optimized per paste type and board density.
2
Solder Paste Inspection (3D SPI)
Inline 3D SPI on every single print. The system measures paste volume, area, height, and offset against the golden board profile with micron-level accuracy. Any deviation triggers an immediate line stop and correction before components are placed. This single gate eliminates the leading cause of post-reflow defects.
3
Pick & Place
High-speed modular placement platform with 160 feeder positions and vision-centering on every component. Handles the full range from 01005 (0.4 mm × 0.2 mm) passives through 45 mm square BGAs. Closed-loop positional feedback verifies placement accuracy on every cycle. Placement speed of 45,000 CPH sustained across the production run.
4
Reflow Soldering
Twelve-zone convection reflow with real-time thermal profiling per board type. Each profile is validated against IPC/JEDEC J-STD-020 requirements for the specific component set and board mass. Nitrogen atmosphere available for high-reliability and fine-pitch applications where oxidation control is critical. Profile data is archived with the batch record for full traceability.
5
Automated Optical Inspection (AOI)
Dual-stage AOI: post-placement and post-reflow. 100% coverage on every board. The system checks for solder bridging, insufficient solder, tombstoning, lifted leads, component presence, polarity, and offset against the CAD-derived inspection library. Defect images are saved to the batch record. Any board that triggers a defect flag is quarantined for manual review.
6
X-Ray Inspection
Automated X-ray inspection (AXI) for BGA, QFN, and other hidden-joint packages. Detects voiding, insufficient solder, head-in-pillow, and non-wetting defects that optical systems cannot see. BGA void rate is verified against IPC-7095 criteria. Every BGA assembly receives X-ray inspection as a standard step, not an optional add-on.
Technical Specifications
SMT Capability Parameters
Verified specifications for our SMT assembly line. Every parameter below is measured against actual production data, not manufacturer nominal ratings.
| Parameter | Specification |
|---|---|
| Max Board Size | 510 mm × 460 mm |
| Min Board Size | 50 mm × 50 mm |
| Board Thickness | 0.4 mm – 4.5 mm |
| Min Component Size | 01005 (0.4 mm × 0.2 mm) |
| Max Component Height | 25 mm |
| BGA Pitch (Minimum) | 0.3 mm |
| Placement Speed | 45,000 CPH |
| Number of Feeders | 160 (8 mm equivalent) |
| Reflow Zones | 12 (convection, nitrogen-capable) |
| AOI Coverage | 100% post-placement + post-reflow |
| Solder Paste Inspection | 3D SPI on every print |
| X-Ray Inspection | AXI standard for all BGA/QFN assemblies |
Production Equipment
SMT Line Equipment Overview
Each machine in the line is production-caliber, maintained to manufacturer specifications, and calibrated on a scheduled preventive-maintenance cycle.
Reflow Oven
12
Zones
N2
Atmosphere
AOI Machine
100%
Coverage
2×
Stages
X-Ray Inspection
<15%
Max Void
AXI
Type
Quality Assurance
Certifications Governing SMT Production
Every SMT assembly run is executed, inspected, and accepted against the following standards. These are not marketing claims — they are audited, certified, and maintained through ongoing surveillance.
IPC-A-610 Class 3
Acceptability of Electronic Assemblies — the highest performance class. All SMT assemblies are inspected and accepted to Class 3 criteria for high-reliability electronic products where performance on demand is critical and downtime cannot be tolerated.
ISO 9001:2015
Quality management system certified end-to-end. From incoming material control through in-process verification to final outgoing inspection, every step operates under documented procedures with measurable quality objectives and corrective-action loops.
J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies — the process standard governing materials, methods, and verification criteria. All soldering operations, operator training, and process control documentation comply with J-STD-001 requirements.
Request an SMT Assembly Quote
Upload your Gerber files and BOM. We respond with a complete technical and commercial quotation within 24 hours.