Quality control inspection
Quality Control

Zero Defect. Every Board. Every Time.

Multi-stage QC. 100% AOI + electrical test. IPC Class 2/3 compliant.

Quality System

Three-Stage Quality Gate

Every board passes through IQC, IPQC, and OQC before shipment. Nothing ships unchecked.

1
IQC — Incoming Quality Control
Every incoming material batch is inspected: base laminates (Tg, dielectric constant), copper foil (purity, thickness), solder mask & silkscreen ink, chemicals & plating solutions, electronic components (authenticity, date codes). Non-conforming materials are rejected at the gate.
2
IPQC — In-Process Quality Control
AOI after inner layer etching, X-Ray after lamination (layer registration), hole wall quality after drilling, copper plating thickness measurement, AOI after outer layer etching, AOI after solder mask application, visual inspection after silkscreen, first-article inspection at each process step.
3
OQC — Outgoing Quality Control
100% flying probe or fixture electrical test, 100% final visual inspection per IPC-A-610, impedance TDR verification on controlled-impedance boards, dimensional measurement (critical dimensions ±0.05mm), solderability test per batch, ionic contamination test for high-reliability orders.
Reliability Lab

Testing & Analysis Equipment

QC laboratory equipment

In-House Reliability Laboratory

Our reliability lab performs destructive and non-destructive testing to verify process quality and long-term reliability. Key capabilities include:

  • Thermal Stress Test — 288°C solder float, 10 seconds
  • Solderability Test — per IPC J-STD-003
  • Cross-Section Analysis — micro-section preparation & microscopy
  • Ionic Contamination Test — per IPC-TM-650
  • Peel Strength Test — copper adhesion verification
  • Impedance TDR — time-domain reflectometry, ±3% available
  • Thermal Cycling — -40°C to +125°C, up to 1000 cycles
Inspection Technology

Detection Capabilities

3D AOI

  • 3D volumetric solder joint inspection
  • Component presence, polarity, offset
  • Solder bridge / open / insufficient detection
  • Lifted lead & tombstoning detection
  • 0201 component inspection capability
  • 0.5μm/pixel resolution

X-Ray (BGA/QFN)

  • Real-time 2D X-Ray imaging
  • BGA ball void detection (< 25% void per IPC)
  • QFN thermal pad solder coverage
  • Hidden joint inspection (PoP, LGA)
  • Head-in-pillow & cold joint detection
  • 0.5μm focal spot resolution
Quality Metrics

Measured Performance

98.5%+
IPC Class 3 First-Pass Yield
< 50 PPM
Customer-Reported Defect Rate
100%
AOI + E-Test Coverage
99.2%
On-Time Delivery

Quality You Can Trust

Request a quote and see our quality commitment in action. First article report included with every order.

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